US 6,318,957 B1 · Method for handling of wafers with minimal contact

Abstract

The invention is a carrier comprising three support elements connected by an underlying frame. The periphery of a wafer rests upon the support elements. The invention also comprises a wafer handler with a plurality of arms. Spacers space the carrier above a base plate associated with a station in a wafer handling area. An arm slides beneath the frame and between the spacers, but the handler does not contact the wafer. A method of using the handler and carrier is provided where the handler lifts and rotates the carrier with the wafer through various stations in a wafer handling area. A control device reduces the handler speed only at critical points of the processing cycle. The handler is capable of moving a plurality of carriers and wafers simultaneously.

Claims13

Dependent claims

A method of handling a semiconductor wafer comprising the steps of:

providing a wafer carrier having a plurality of spaced support elements defining a wafer support plane and configured to receive spaced peripheral portions of a wafer, said carrier having a frame spaced below said plane connecting the support elements;
inserting an end effector carrying a wafer between the plane and the frame to transfer a wafer to said carrier;
inserting an arm of a wafer handler beneath said carrier;
lifting said carrier without contacting the wafer;
rotating said handler, with said carrier and wafer supported by said arm, to a second station;
lowering said handler arm to transfer the carrier and wafer onto a plurality of spacers at said second station;
and
rotating said wafer handler arm without said carrier and wafer to a position out from beneath the carrier.

5 more elements

Dependencies are inferred from the claim text.

Method for handling of wafers with minimal contact

Life of this patent

Method for handling of wafers with minimal contact

Life of this patent

Abstract

Claims13