O-ring sealed bakable trays

Abstract

In order to simplify the process of preparing and packaging of semiconductor chips and the like type of items for transport to customers who use the items in the production of larger devices such as computers and the like, the items are placed in the trays. An o-ring or the like type of gasket is disposed between each of the trays (wherein the upper tray acts as lid for the lower one). This resilient member has a predetermined shape/configuration which maintains a gap or non-sealing condition between the trays sufficient to permit moisture to escape from the trays during baking in an oven. When the interiors of the trays are desiccated, the upper tray is strapped down on the lower tray or trays, with sufficient force as to be deform the gasket to the degree that a hermetic seal is produced at each interface. Stacks of trays can be baked, desiccated, cooled in a dry/desiccated atmosphere, and then strapped together to cause each container to become hermetically sealed.

Dependencies are inferred from the claim text.