Micromechanical component and method for producing the micromechanical component

A method for producing a micromechanical component, comprising:

• drafting a design of the micromechanical component having a first geometric design parameter and a second geometric design parameter;
• etching a work piece to form the micromechanical component, the micromechanical component including a particular structure having bars and trenches, wherein during the etching, the first geometric design parameter and the second geometric design parameter being formed with a process tolerance, the micromechanical component having at least one function variable, the at least one function variable including one of an electrical function variable and a mechanical function variable, the at least one function variable being dependent on the at least first design parameter and the second design parameter;
• determining a dependency of the at least one function variable on the process tolerance of the first geometric design parameter and the second geometric design parameter;
• deriving a relationship between the first design parameter and the second design parameter to minimize the dependency of the function variable;
• and
• determining the first design parameter and the second design parameter so that the relationship is fulfilled with respect to the process tolerance.

A micromechanical component, comprising:

• a first geometric parameter and a second geometric parameter;
• a structure having bars and trenches, the structure being formed by an etching process, wherein during the etching, the first geometric design parameter and the second geometric design parameter are formed with a process tolerance;
• and
• at least one function variable, the at least one function variable including one of an electrical function variable and a mechanical function variable, the at least one function variable being dependent on the first design parameter and the second design parameter, the first design parameter and the second design parameter being set to minimize the dependency of the at least one function variable with respect to the process tolerance.

A capacitive acceleration sensor composed of polycrystalline silicon and produced by a surface micromachining procedure, comprising:

• a spring device having springs;
• a seismic mass device suspended on the spring device;
• a movable capacitor place device attached to the seismic mass device;
• and
• a fixed capacitor place device cooperating with the movable capacitor plate device,
• wherein the seismic mass device and the movable capacitor place device include bars having a first process-specific value range for a first width of the bars,
• wherein a second width of the springs is within a second process-specific value range, and
• wherein a ratio of the first width and the second width is between 0.5 and 0.9.

A capacitive acceleration sensor composed of polycrystalline silicon and produced by a surface micromachining procedure, comprising:

• a spring device having springs;
• a seismic mass device suspended on the spring device;
• a movable capacitor plate device attached to the seismic mass device;
• and
• a fixed capacitor plate device cooperating with the movable capacitor plate device,
• wherein the movable capacitor plate device is made in the form of two connected bars which have a first specific value process range for a first width of the connected bars, and wherein a second width of the springs is within a second process-specific value range.

A capacitive acceleration sensor produced by a micromachining procedure, comprising:

• a spring device having springs;
• a seismic mass device suspended on the spring device;
• a movable capacitor plate device attached to the seismic mass device;
• and
• a fixed capacitor plate device cooperating with the movable capacitor plate device,
• wherein the movable capacitor plate device is made in the form of two connected bars which have a first process specific value range for a first width of the connected bars and a second width of the springs is within a second process specific value range.

A capacitive acceleration sensor produced by a micromachining procedure, comprising:

• a spring device having springs;
• a seismic mass device suspended on the spring device;
• a movable capacitor plate device attached to the seismic mass device;
• and
• a fixed capacitor plate device cooperating with the movable capacitor plate device,
• wherein the movable capacitor plate device has a first and a second arm which are connected by cross-bars, wherein a first width of the first and second arm has a first process specific value range and a second width of the springs is within a second process specific value range.