Embedded thin film passive components

A method for the manufacture of a multi-level printed circuit board comprising the steps of:

• a. depositing a first metal layer on the surface of a first printed circuit board level,
• b. patterning said first layer to form a first planar capacitor electrode,
• c. forming a dielectric layer over the first planar electrode,
• d. depositing a second metal layer over the dielectric layer,
• e. patterning said second metal layer to form a second planar electrode, said second planar electrode covering said dielectric layer except for a portion of said insulating layer remaining uncovered, said portion of said insulating layer remaining uncovered providing a first interconnection region, said second planar electrode having an additional portion extending laterally beyond said insulating layer, said additional portion of said second planar electrode providing a second interconnection region,
• f. adhesively bonding a second printed circuit board level to the surface of said first printed circuit board level thereby producing a multi-level printed circuit board, with said first and second planar electrodes, and said dielectric layer buried between said first and second printed circuit board levels,
• g. forming through holes through at least said second printed circuit board level with a first through hole through said first interconnection region and a second through hole through said second interconnection region, and
• h. coating said through holes with metal to form electrical contacts to said first and second planar electrodes.