Interconnector electrically connecting plurality of electronic device elements, fabrication method thereof, and join apparatus thereof

An interconnector comprising:

• a first connecting portion connected to an electrode of a first electronic device element,
• a second connecting portion connected to an electrode of a second electronic device element adjacent to said first electronic device element,
• a stress relief portion absorbing displacement generated between said first electronic device element and said second electronic device element, and
• wherein at least one of said first connecting portion and said second connecting portion has at least one notch formed at an oblique angle with respect to said at least one of the first connecting portion and the second connection portion.

An interconnector comprising:

• a first connecting portion connected to an electrode of a first electronic device element,
• a second connecting portion connected to an electrode of a second electronic device element adjacent to said first electronic device element,
• a stress relief portion absorbing displacement generated between said first electronic device element and said second electronic device element, and
• wherein at least one of said first connecting portion and said second connecting portion has at least one notch formed in a lateral direction of said at least one of the first connecting portion and the second connecting portion, so that said at least one notch is perpendicular to an end of said at least one connecting portion.

An interconnector comprising:

• a first connecting portion connected to an electrode of a first electronic device element,
• a second connecting portion connected to an electrode of a second electronic device element adjacent to said first electronic device element,
• a stress relief portion absorbing displacement generated between said first electronic device element and said second electronic device element, and
• wherein at least one of said first connecting portion and said second connecting portion has at least one notch formed in a zigzag manner.

An interconnector comprising:

• a first connecting portion connected to an electrode of a first electronic device element,
• a second connecting portion connected to an electrode of a second electronic device element adjacent to said first electronic device element,
• two stress relief portions absorbing displacement generated between said first electronic device element and said second electronic device element, and
• wherein at least one of said first connecting portion and said second connecting portion has at least one notch.