Porous silicon oxycarbide integrated circuit insulator
AssigneeMicron Technology, Inc.
InventorsKie Y. Ahn, Leonard Forbes
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AssigneeMicron Technology, Inc.
InventorsKie Y. Ahn, Leonard Forbes
Estimating the term…
An integrated circuit includes at least one porous silicon oxycarbide (SiOC) insulator, which provides good mechanical strength and a low dielectric constant (e.g., εR<2) for minimizing parasitic capacitance. The insulator provides IC isolation, such as between circuit elements, between interconnection lines, between circuit elements and interconnection lines, or as a passivation layer overlying both circuit elements and interconnection lines. The low dielectric constant silicon oxycarbide isolation insulator of the present invention reduces the parasitic capacitance between circuit nodes. As a result, the silicon oxycarbide isolation insulator advantageously provides reduced noise and signal crosstalk between circuit nodes, reduced power consumption, faster circuit operation, and minimizes the risk of potential timing faults.
An integrated circuit formed on a substrate, comprising:
An integrated circuit formed on a substrate comprising:
An integrated circuit formed on a substrate, comprising:
An integrated circuit formed on a substrate, comprising:
An integrated circuit formed on a substrate, comprising:
An integrated circuit formed on a substrate, comprising:
An integrated circuit formed on a substrate, comprising:
An integrated circuit formed on a substrate, comprising:
Dependencies are inferred from the claim text.