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US 6,313,432 B1Granted
Laser cutting method and laser cutter
AssigneeTanaka Engineering Works, Ltd.
InventorsYozo Nagata, Masayuki Nagahori
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AssigneeTanaka Engineering Works, Ltd.
InventorsYozo Nagata, Masayuki Nagahori
Estimating the term…
A development of a laser cutting method and a laser cutter in which the adverse effects such as self burning to the cutting surface can be prevented, when the material is cut at a high speed, has been desired. In order to achieve the object, the present invention provides a laser cutting method and a laser cutter in which a cutting laser beam 22 is applied to a material 25 to be cut at a cutting point 26, while ejecting gases 23 and 24 to the cutting point 26 or its surrounding area from a plurality of nozzle openings 30 and 31 arranged in a ring or in a line, wherein the oxygen concentrations of the gases 23 and 24 ejecting from at least one of the nozzle opening 30 and 31 are changed to adjust the oxygen concentration distribution in an area within several millimeters of the cutting point 26; thereby the cutting quality can be improved.
A laser cutting method in which a cutting laser beam is applied to a material to be cut at a cutting point, while ejecting gas to the cutting point or its surrounding area from a plurality of nozzles arranged in a ring or in a line, wherein an oxygen concentration of the gas ejecting from at least one of the nozzles is changed to adjust the oxygen concentration distribution in an area within several millimeters of the cutting point.
A laser cutter comprising a plurality of nozzle openings arranged in a line or in a ring, and gas supplying means for supplying gases to the nozzle openings and adjusting the oxygen concentration of the gases, wherein the gases ejecting from the nozzle openings can be respectively adjusted by the gas supplying means.
Dependencies are inferred from the claim text.