Polishing apparatus
AssigneeEbara Corporation
InventorsTetsuji Togawa, Nobuyuki Takada, Seiji Katsuoka, Hiroyuki Osawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeEbara Corporation
InventorsTetsuji Togawa, Nobuyuki Takada, Seiji Katsuoka, Hiroyuki Osawa
Estimating the term…
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a transferring device for transferring the workpiece between the top ring and the transferring device. The transferring device includes a stage having a support surface for supporting the workpiece, an actuating unit for moving the stage in a vertical direction, and a guide member disposed radially outwardly of the stage and having a guide surface of an inverted conical shape. The centering of the workpiece is conducted by bringing a periphery of the workpiece into contact with the guide surface, and then the workpiece is transferred from the transferring device to the top ring by raising the stage.
A polishing apparatus for polishing a surface of a workpiece comprising:
A polishing apparatus for polishing a surface of a workpiece comprising:
A method of polishing a surface of a workpiece in a polishing apparatus;
Dependencies are inferred from the claim text.