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US 6,310,792 B1Granted
Shared package for VRM and processor unit
AssigneeIntel Corporation
InventorJosef Drobnik
Life of this patent
Estimating the term…
Abstract
A component module includes a processor and at least a portion of a voltage regulator module which regulates voltages being supplied to said processor.
Claims17
A component module, comprising:
- a packaging material within said module;
- a processor mounted on said packaging material;
- and
- at least a portion of a voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor,
- said component module providing common packaging for said processor and said portion of said voltage regulator module and utilizing high density packaging technique.
2 more elements
A semiconductor integrated circuit package, comprising:
- a packaging material within said package;
- a processor mounted on said packaging material;
- and
- a voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor;
- wherein said semiconductor integrated circuit package supplies processor capabilities;
- said package providing a common package for said processor and said voltage regulator module and utilizing high density packaging technique.
3 more elements
A semiconductor integrated circuit package, comprising:
- a packaging material within said package;
- a processor mounted on said packaging material;
- and
- a high frequency alternating current voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor;
- wherein said semiconductor integrated circuit package supplies processor capabilities to a motherboard;
- said package providing a common package for said processor and said high frequency alternating current voltage regulator module and utilizing high density packaging technique.
3 more elements
A component module comprising:
- a processor;
- and
- at least a portion of the voltage regulator module which regulates voltages being supplied to said processor;
- wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.
1 more element
A semiconductor integrated circuit package, comprising:
- a processor;
- and
- a voltage regulator module which regulates voltages being supplied to said processor;
- wherein said semiconductor integrated circuit package supplies processor capabilities;
- wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.
2 more elements
A semiconductor integrated circuit package, comprising:
- a processor;
- and
- a high frequency alternating current voltage regulator module which regulates voltages being supplied to said processor;
- wherein said semiconductor integrated circuit package supplies processor capabilities to a motherboard;
- wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.
2 more elements
Dependencies are inferred from the claim text.