Connection pin layout for connecting integrated magnetics modules to a printed circuit board

A printed circuit board (PCB) including a connection pin layout for connecting a plurality of integrated magnetics modules to the PCB, comprising:

• a power pin for connecting power between the plurality of integrated magnetics modules and the PCB, said power pin located on a periphery of the connection pin layout;
• a plurality of data pins for making a plurality of data connections between the plurality of integrated magnetics modules and the PCB, wherein said plurality of data connections is encompassed by a data trace;
• a chassis ground pin for making a chassis ground connection between the plurality of integrated magnetics modules and the PCB, wherein said chassis ground connection is encompassed by a chassis ground trace;
• and
• a power trace connecting said power pin to a source of electrical power, said power trace routed on the PCB, wherein said power trace circumvents a perpendicular projection of an area containing said plurality of data pins and said chassis ground pin and circumvents said data trace and said chassis ground trace.

A printed circuit board (PCB) including a connection pin layout for connecting a plurality of integrated magnetics modules to the PCB, comprising:

• a plurality of power pins for connecting power between the plurality of integrated magnetics modules and the PCB, said plurality of power pins located together and on a periphery of the connection pin layout;
• a plurality of data pins for making a plurality of data connections between the plurality of integrated magnetics modules and the PCB, wherein said plurality of data connections are encompassed by a data trace;
• a chassis ground pin for making a chassis ground connection between the plurality of integrated magnetics modules and the PCB, wherein said chassis ground connection is encompassed by a chassis ground trace;
• and
• a power trace connecting said plurality of power pins to a source of electrical power routed on the PCB, wherein said power trace circumvents a perpendicular projection of an area containing said plurality of data pins and said chassis ground pin and circumvents said data trace and said chassis ground trace.

A method of connecting an integrated magnetics module to a printed circuit board (PCB), comprising:

• arranging a plurality of connection pins for connecting the integrated magnetics module to the PCB;
• assigning a power connection pin on a periphery of said plurality of connection pins;
• assigning a plurality of data connections from said plurality of connection pins, wherein said plurality of data connections is encompassed by a data trace;
• assigning a chassis ground connection from said plurality of connection pins, wherein said chassis ground connection is encompassed by a chassis ground trace;
• and routing a power trace to said power connection pin, wherein said power trace circumvents a perpendicular projection of an area containing said plurality of data connections and said chassis ground connection and circumvents said data trace and said chassis ground trace.

A method of connecting a plurality of integrated magnetics modules to a printed circuit board (PCB), comprising:

• arranging a plurality of connection pins for connecting the plurality of integrated magnetics modules to the PCB;
• assigning a power connection pin on a periphery of said plurality of connection pins;
• assigning a plurality of data connections from said plurality of connection pins, wherein said plurality of data connections is encompassed by a data trace;
• assigning a chassis ground connection from said plurality of connection pins, wherein said chassis ground connection is encompassed by a chassis ground trace;
• and
• routing a power trace to said power connection pin, wherein said power trace circumvents a perpendicular projection of an area containing said plurality of data connections and said chassis ground connection and circumvents said data trace and said chassis ground trace.

A method of connecting a plurality of integrated magnetics modules to a printed circuit board (PCB), comprising:

• arranging a plurality of connection pins for connecting the plurality of integrated magnetics modules to the PCB;
• assigning a plurality of power connection pins located together and on a periphery of said plurality of connection pins;
• assigning a plurality of data connections from said plurality of connection pins, wherein said plurality of data connections is encompassed by a data trace;
• assigning a chassis ground connection from said plurality of connection pins, wherein said chassis ground connection is encompassed by a chassis ground trace;
• and
• routing a power trace to said power connection pin, wherein said power trace circumvents a perpendicular projection of an area containing said plurality of data connections and said chassis ground connection and circumvents said data trace and said chassis ground trace.