Transverse mountable heat sink for use in an electronic device

Abstract

The present invention provides a heat sink that, in an advantageous embodiment, includes a spine having a width with first and second opposing sides that are oriented to be abnormal to the substrate when the heat sink is mounted on the substrate. The heat sink further includes an electronic device support leg that extends generally transverse from the first side and that is configured to support a heat generating electrical component thereon. Alternative embodiments of the present invention may include a plurality of such electronic device support legs. A plurality of cooling fins are also included in the present invention, extending from the second side. Moreover, each of the plurality of cooling fins has a depth that is substantially less than the width of the heat sink, which give this unique heat sink an exceptional cooling efficiency. In particular advantageous embodiments, the depth to width ratio of the fins and spine, may range from about 1 to 5 or 1 to 10, respectively.

Dependencies are inferred from the claim text.