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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHiroshi Sugawara, Tamotsu Kaneko, Sadahiro Gomi, Masayuki Ito
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A reactance of a reactance element in a multi-layer circuit board apparatus is trimmed by cutting a portion of the circuit pattern of the reactance element with a laser beam. The reactance element is sandwiched between grounded layers. A coil circuit pattern having at least a hole therein may be provided as the reactance element. A side portion between the edge of the coil circuit pattern and the hole is cut with the laser beam to trim the inductive reactance. Cutting is effected while the circuit is operated and the operating condition such as an oscillation frequency is observed. A plurality of holes may be provided in the coil circuit pattern. The trimming amount of the inductive reactance is determined by the number of the hole subjected to cutting. The holes may have different sizes. The trimming amount is obtained by which one of the hole is subjected to cutting. The distance between the cut circuit pattern is equal to or larger than the thickness of the circuit pattern. A capacitive element may be provided as the reactance element which includes first and second comb circuit patterns of which teeth are interlace with each other. A portion of a tooth is cut to trim the capacitive reactance. Another capacitive reactance element including two conductor insulated with a dielectric substrate can be also trimmed similarly.
A multi-layer circuit board comprising:
A method of trimming a reactance element comprising the steps of:
A method of trimming a reactance element including a circuit pattern at one of conductive layers of a multi-layer circuit board, said reactance element being operated by a high frequency circuit on said multi-layer circuit board, comprising the steps of:
A method of trimming a coil circuit provided at one of conductive layers of a multi-layer circuit board apparatus, said coil circuit including a circuit pattern having a plurality of holes therein along said circuit pattern, for providing an initial inductance, each of holes being arranged between first and second side portions provided between side edges of said circuit patterns, said coil circuit being operated by a high frequency circuit on said multi-layer circuit board, comprising the steps of:
A method of trimming a capacitive circuit provided at one of conductive layers of a multi-layer circuit board apparatus, said capacitive circuit including first and second comb circuit patterns, on said one of said conductive layer, of which teeth of said first and second comb circuit patterns are interlaced with each other with isolation for providing a capacitance, said capacitive circuit being operated by a high frequency circuit on said multi-layer circuit board, comprising the steps of:
Dependencies are inferred from the claim text.