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US 6,310,484 B1Granted
Semiconductor test interconnect with variable flexure contacts
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Alan G. Wood
Life of this patent
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AssigneeMicron Technology, Inc.
InventorsSalman Akram, Alan G. Wood
Estimating the term…
An interconnect for testing semiconductor components includes a substrate, and interconnect contacts on the substrate for electrically engaging terminal contacts on the components. The interconnect also includes one or more cavities in the substrate which form flexible segments proximate to the interconnect contacts. The flexible segments permit the interconnect contacts to move independently in the z-direction to accommodate variations in the height and planarity of the terminal contacts. In addition, the cavities can be pressurized, or alternately filled with a polymer material, to adjust a compliancy of the flexible segments. Different embodiments of the interconnect contacts include: metallized recesses for retaining the terminal contacts, metallized projections for penetrating the terminal contacts, metallized recesses with penetrating projections, and leads contained on a polymer tape and cantilevered over metallized recesses. The interconnect can be used to construct a wafer level test system for testing wafer sized components, such as wafers and boards, or to construct a die level test system for testing die sized components, such as unpackaged dice and chip scale packages.
An interconnect for testing a semiconductor component having a terminal contact comprising:
An interconnect for testing a semiconductor component having a plurality of terminal contacts comprising:
An interconnect for testing a semiconductor component having a bumped terminal contact comprising:
An interconnect for testing a semiconductor component having a terminal contact comprising:
An interconnect for testing a semiconductor component having a terminal contact comprising:
Dependencies are inferred from the claim text.