Electronic component in particular an saw component operating with surface acoustic waves and a method for its production

An electronic component, comprising:

• a piezoelectric substrate, electrically conductive structures on said substrate and a plastic cap cover sealingly encapsulating said substrate and said structures for protection against environmental influences;
• said plastic cap cover being seated directly on said piezoelectric substrate and having passages;
• in the form of blind holes formed therein, said passages having bottom parts defined by pad metallizations applied directly on said substrate and electrically connected to said structures;
• said plastic cap cover carrying solderable metallizations formed by a material layer sequence of titanium-tungsten, nickel and gold and having through-plated holes through said passages electrically connecting directly said pad metallizations of said structures with said metallizations on said plastic cap cover;
• and
• said metallizations on said plastic cap cover and said through-plated holes being multi-layer metalizations made from the same material and formed together in the same step.