Substrate for high-voltage modules
AssigneeSiemens Aktiengesellschaft
InventorsMichael Stoisiek, Guy Lefranc, Reinhold Bayerer, Rainer Leuschner
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Abstract
A metallic-ceramic substrate having a ceramic layer and metal layers on both sides of the ceramic layer is provided with a high-impedance layer at the surface of the ceramic layer. The high-impedance layer is located adjacent to the metal layers. Therefore, the electrical field intensity at the edges of the metal layers is limited and an even distribution of the electrical potential at the surface of the ceramic layer is achieved. For example, the high-impedance layer may include a thin CrNi-layer, a doped Si-layer, an a—C:H-layer or a Ti-implantation.
Claims16
A substrate for high-voltage units comprising:
- a ceramic layer having a first main side and a second main side that is opposite to the first main side;
- an upper metal layer disposed on the first main side and a lower metal layer disposed on the second main side;
- a high-impedance layer having at least a portion disposed adjacent to the upper metal layer at the first main side of the ceramic layer, the high-impedance layer also having one of the at least a portion electrically connected to an electrical conductor that is, in turn, electrically connected to the lower metal layer and another portion disposed adjacent to the lower metal layer;
- and
- the high-impedance layer effecting an electrically conductive path between the upper metal layer and the lower metal layer.
A substrate for high-voltage modules comprising:
- a ceramic layer having a first main side and a second main side that is opposite to the first main side;
- an upper metal layer disposed on the first main side and an lower metal layer disposed on the second main side;
- electrical conductors disposed at the first main side at edges of the upper metal layer, the electrical conductors being increasingly spaced from the ceramic layer with respective increasing distances along a length of the electrical conductors away from the upper metal layer.
A substrate for high-voltage modules comprising:
- a ceramic layer having a first main side and a second main side that is opposite to the first main side;
- an upper metal layer disposed on the first main side and a lower metal layer disposed on the second main side;
- an electrically conductive bottom plate that is connected to the ceramic layer via the lower metal layer;
- an edge metallization disposed at a distance from the upper metal layer on the first main side of the ceramic layer, the edge metallization entirely surrounding the upper metal layer to form a field emission area and electrically connected to the lower metal layer through a low-impedance.
Dependencies are inferred from the claim text.