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US 6,310,395 B1Granted
Electronic component with anodically bonded contact
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYoshiharu Takahashi, Toshiaki Shinohara
Life of this patent
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Abstract
An electronic component includes an inner lead having a tip with a projection; an insulating coating that is electrically conductive when heated disposed around the projection; and a metallic coating disposed around an electrode on a semiconductor chip, with a crater reaching the electrode, the projection engaging the crater to make a contact between the inner lead and the electrode, the insulating coating and the metallic coating being anodically bonded to each other.
Claims2
An electronic component including:
- an inner lead having a tip with a projection;
- an insulating coating that is electrically conductive when heated disposed around said projection;
- and
- a metallic coating disposed around an electrode on a semiconductor chip, with a crater reaching said electrode, said projection engaging the crater to make a contact between said inner lead and said electrode, said insulating coating and said metallic coating being anodically bonded to each other.
1 more element
An electronic component including:
- an inner lead;
- an insulating coating that is electrically conductive when heated, the insulating coating being adhered to a tip portion of said inner lead and having a crater;
- and
- a convex electrode protruding from a metallic coating on a surface of a semiconductor chip and contacting said inner lead in the crater, said insulating coating and said metallic coating being anodically bonded to each other.
1 more element
Dependencies are inferred from the claim text.