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US 6,310,394 B1Granted
Reduced parasitic capacitance semiconductor devices
AssigneeTyco Electronics Corporation
InventorsYoginder Anand, Percy Bomi Chinoy
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Abstract
Semiconductor devices comprise a substrate having a semiconductor disposed thereon with a layer of dielectric material, less than 10 microns thick, disposed about the semiconductor; the dielectric layer has a bond pad disposed on its upper surface a via lined with an electrically conductive material and extending between the bond pad and the semiconductor form an electrically conductive path between the semiconductor device and the bond pad.
Claims14
A structure for a semiconductor device comprising:
- a substrate:
- a semiconductor device disposed on said substrate;
- a layer of dielectric material disposed about said semiconductor device and having a thickness of less than ten microns;
- a via defined in said layer of dielectric material and extending between a top surface of said layer of dielectric material and said semiconductor device;
- a bond pad disposed on said top surface of said layer of dielectric material;
- and
- a layer of electrically conductive material disposed in said via, defining a bonding surface and being dimensioned and arranged to form an electrically conductive path between said semiconductor device and said bond pad.
4 more elements
A structure for a semiconductor device comprising:
- a substrate;
- a semiconductor device disposed on said substrate;
- a layer of dielectric material disposed about said semiconductor device and having a thickness of less than ten microns;
- a via defined by an opening in said layer of dielectric material extending between a top surface of said layer of dielectric material and a top surface of said semiconductor device;
- and
- a layer of electrically conductive material forming an inverted mesa within said via, said layer of electrically conductive material being dimensioned and arranged to form an electrically conductive path between said semiconductor device and one of a bonding wire and a bonding ribbon and having a continuous upper surface portion completely covering said opening to thereby define a bond pad.
3 more elements
Dependencies are inferred from the claim text.