Electric circuit and package for semiconductor

A semiconductor package comprising:

• (1) a semiconductor element having at least one power supply terminal, at least one ground terminal, and at least one output terminal;
• (2) at least one non-parasitic inductance;
• and (3) at least one capacitance,
• wherein one terminal of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element and the other terminal is connected to the ground terminal of the semiconductor element,
• the ground terminal of the semiconductor element is connected to a ground terminal of the semiconductor package without a capacitive element therebetween,
• the power supply terminal of the semiconductor element is connected to a power supply terminal of the semiconductor package via the inductance, and
• the output terminal of the semiconductor element is connected to an output terminal of the semiconductor package.

A semiconductor package comprising:

• (1) a semiconductor element having at least one power supply terminal, at least one ground terminal, and at least one output terminal;
• (2) at least one non-parasitic inductance;
• and (3) at least one capacitance,
• wherein one terminal of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element and the other terminal is connected to the ground terminal of the semiconductor element,
• the power supply terminal of the semiconductor element is connected to a power supply terminal of the semiconductor package,
• the ground terminal of the semiconductor element exclusively is connected to a ground terminal of the semiconductor package via the inductance, and
• the output terminal of the semiconductor element is connected to an output terminal of the semiconductor package.

A semiconductor package comprising:

• (1) a semiconductor element having at least one power supply terminal, at least one ground terminal, and at least one output terminal;
• (2) at least two inductances;
• and (3) at least one capacitance,
• wherein one terminal of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element and the other terminal is connected to the ground terminal of the semiconductor element,
• the ground terminal of the semiconductor element is connected to a first ground terminal of the semiconductor package,
• the power supply terminal of the semiconductor element is connected to a first power supply terminal of the semiconductor package,
• the ground terminal of the semiconductor element is connected to a second ground terminal of the semiconductor package via a first inductance of the at least two inductances,
• the power supply terminal of the semiconductor element is connected to a second power supply terminal of the semiconductor package via a second inductance of the at least two inductances, and
• the output terminal of the semiconductor element is connected to an output terminal of the semiconductor package.

A semiconductor package comprising:

• (1) a semiconductor element having at least one power supply terminal, at least one ground terminal, and at least one pair of differential output terminals;
• (2) at least two inductances;
• and (3) at least one capacitance,
• wherein one terminal of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element and the other terminal is connected to the ground terminal of the semiconductor element,
• the ground terminal of the semiconductor element is connected to a ground terminal of the semiconductor package via the first inductance of the at least two inductances,
• the power supply terminal of the semiconductor element is connected to a power supply terminal of the semiconductor package via the second inductance of the at least two inductances, and
• the pair of differential output terminals of the semiconductor element are connected to a pair of differential output terminals of the semiconductor package.

An electric circuit comprising:

• (1) a semiconductor element having at least one power supply terminal, at least one ground terminal, and at least one pair of differential output terminals;
• at least two inductances;
• and
• at least one capacitance,
• wherein one terminal of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element and the other terminal is connected to the ground terminal of the semiconductor element,
• the ground terminal of the semiconductor element is grounded via a first inductance of the at least two inductances,
• the power supply terminal of the semiconductor element is connected to a power supply via a second inductance of the at least two inductances, and
• the pair of differential output terminals of the semiconductor element are connected to a pair of terminals.