Mounted structure of circuit board and multi-layer circuit board therefor

Abstract

The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other. The mounted structure of circuit board comprises a 6-layer circuit board 2 having a laminate of three sheets of double-sided circuit boards 1 and a chip 13 connected to a circuit 5 on the uppermost layer. The core material 3 embedded in the intraboard insulating layer 4 in various double-sided circuit board 1 comprises a copper layer 3a having a heat conductivity of 393 W/·K provided on at least one side of an Ni—Fe alloy foil 25. The chip 13 and the underlying core material 3 are connected to each other with a solder metal member 10. The core material 3 on the horizontally adjacent double-sided circuit boards 1 are similarly connected to each other with the solder metal member 10.

Dependencies are inferred from the claim text.