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US 6,310,364 B1Granted
Light-emitting apparatus
AssigneeToyoda Gosei Co., Ltd.
InventorToshiya Uemura
Life of this patent
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Abstract
A transparent base having a GaN semiconductor light-emitting device fixed thereon with a transparent adhesive is fitted to lead frames by flip chip bonding in such a manner that the light from the device is emitted outside through the substrate of the device, the adhesive, the base, and a sealing resin in this order. The apparatus has high relaibility beacause the sealing resin in the dominant direction or light emission is protected against color change due to the heat generated from the device.
Claims13
A light-emitting apparatus comprising:
- a transparent base made of an inorganic material;
- a first and a second bonding pad formed on the base;
- a GaN semiconductor light-emitting device having a transparent substrate, a first and a second electrode on one side thereof;
- a first and a second wire which connect said first bonding pad to said first electrode and said second bonding pad to said second electrode, respectively;
- a first and a second lead frame to which said trasparent base is fixed so that the substrate of said semiconductor light-emitting device faces the dominant light emitting direction of said light-emitting apparatus, and said first and second bonding pads being electrically connected to said first and second lead frames, respectively;
- and
- a transparent adhesive layer which fixes the transparent substrate of said semiconductor light-emitting device, said first and second wires, said first and second lead frames, and said adhesive layer.
4 more elements
Dependencies are inferred from the claim text.