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US 6,310,303 B1Granted
Structure for printed circuit design
OwnerJohn J. Luvara, John J. Quigley, Jr. +1inventors
InventorsJohn J. Luvara, John J. Quigley, Jr., Ray Prasad
Life of this patent
Estimating the term…
Abstract
A substrate structure for surface mount devices, including a plurality of substrate layers including at least a base layer and an outer layer; the base layer having a contact surface and a first array of conductive elements on the contact surface; the outer layer having a contact surface, a second array of conductive elements on the contact surface, and at least one access passing through the outer layer and the outer layer being mounted to the base layer with the access positioned over the first array, wherein the first array and the second array define in combination a device mounting site.
Claims33
A substrate structure for surface mount devices, comprising:
- a plurality of substrate layers including at least a base layer and an outer layer;
- said base layer having a contact surface and a first array of conductive elements on said contact surface;
- said outer layer having a contact surface, a second array of conductive elements on said contact surface, and at least one access passing through said outer layer;
- and
- said outer layer being mounted to said base layer with said access positioned over said first array, wherein said first array and said second array define in combination a device mounting site, and further comprising at least one intermediate layer disposed between said base layer and said outer layer and having a contact surface, an access passing through said intermediate layer, and a third array of conductive elements, said access of said intermediate layer being positioned over said first array of conductive elements and said access of said outer layer being positioned over said first array of conductive elements and said third array of conductive elements whereby said first, second and third arrays define in combination said device mounting site.
2 more elements
A substrate structure for surface mount devices, comprising:
- a base layer having a contact surface and a first array of conductive elements on said contact surface;
- and
- at least one additional layer each having a contact surface, an access and a further array of conductive elements on said contact surface, said at least one additional layer being positioned substantially adjacent to said base layer such that said first array and said further array of each additional layer define in combination a device mounting site, wherein said at least one additional layer comprises a plurality of layers stacked adjacent to said base layer, and wherein said access of each additional layer positioned sequentially away from said base layer is at least as large as said further array of a preceding layer of said plurality of layers.
A printed circuit structure, comprising:
- a surface mount device having a mounting surface and a plurality of conductive members disposed on said mounting surface;
- and
- a substrate structure for mounting said device, comprising a plurality of substrate layers including at least a base layer and an outer layer;
- said base layer having a contact surface and a first array of conductive elements on said contact surface;
- said outer layer having a contact surface, an access and a second array of conductive elements on said contact surface;
- and said outer layer being mounted relative to said base layer with said access positioned over said first array, said first array and said second array defining in combination a device mounting site;
- and
- further comprising at least one intermediate layer disposed between said base layer and said outer layer and having a contact surface, an access passing through said intermediate layer, and a third array of conductive elements, said access of said intermediate layer being positioned over said first array of conductive elements and said access of said outer layer being positioned over said first array of conductive elements and said third array of conductive elements whereby said first, second and third arrays define in combination said device mounting site;
- said surface mount device being connected to said mounting site with said conductive members connected to said first array, said second array and said third array.
6 more elements
A substrate structure for surface mount devices, comprising:
- a plurality of substrate layers including at least a base layer and an outer layer;
- said base layer having a contact surface and a first array of conductive elements on said contact surface;
- said outer layer having a contact surface, a second array of conductive elements on said contact surface, and at least one access passing through said outer layer;
- and
- said outer layer being mounted to said base layer with said access positioned over said first array, wherein said access comprises a plurality of holes positioned on said outer layer and aligned with said first array of conductive elements on said base layer, and further comprising at least one intermediate layer disposed between said base layer and said outer layer and having a contact surface, a plurality of holes, and a third array of conductive elements, said plurality of holes of said intermediate layer being positioned over said first array of conductive elements and said plurality of holes of said outer layer being positioned over said first array of conductive elements and said third array of conductive elements whereby said first, second and third arrays of conductive elements define, in combination, said device mounting site.
2 more elements
A substrate structure for surface mount devices, comprising:
- a base layer having a contact surface and a first array of conductive elements on said contact surface;
- at least one additional layer each having a contact surface, an access and a further array of conductive elements on said contact surface, said at least one additional layer being positioned substantially adjacent to said base layer such that said first array and said further array of each additional layer define in combination a device mounting site;
- wherein said access comprises a plurality of holes positioned on said at least one additional layer and aligned with said first array of conductive elements on said base layer;
- and
- wherein said at least one additional layer comprises at least two additional layers disposed on said base layer and each having a contact surface, a plurality of holes, and a further array of conductive elements, said plurality of holes of each of said at least two additional layers being positioned over said first array of conductive elements, whereby said first array and said further arrays of conductive elements define, in combination, said device mounting site.
2 more elements
A printed circuit structure, comprising:
- a surface mount device having a mounting surface and a plurality of conductive members disposed on said mounting surface;
- and
- a substrate structure for mounting said device, comprising a plurality of substrate layers including at least a base layer and an outer layer;
- said base layer having a contact surface and a first array of conductive elements on said contact surface;
- said outer layer having a contact surface, an access and a second array of conductive elements on said contact surface;
- and said outer layer being mounted relative to said base layer with said access positioned over said first array, wherein said access comprises a plurality of holes positioned on said outer layer and aligned with said first array of conductive elements on said base layer;
- and
- said substrate structure further comprising at least one intermediate layer disposed between said base layer and said outer layer and having a contact surface, a plurality of holes, and a third array of conductive elements, said plurality of holes of said intermediate layer being positioned over said first array of conductive elements, and said plurality of holes of said outer layer being positioned over said first array of conductive elements and said third array of conductive elements, whereby said first, second and third arrays of conductive elements define, in combination, a device mounting site, said surface mount device being connected to said device mounting site with said conductive members connected to said first array, said second array and said third array of conductive elements.
5 more elements
Dependencies are inferred from the claim text.