Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same

A surface mountable circuit board for a power supply, comprising:

• a substrate having electrical components on opposing faces thereof, said substrate having a conductive layer and a via coupled in electrical communication therewith;
• an inter-substrate conductive mount having a compound curved surface thereon, composed of a material having a melting point above a solder reflow temperature and recessed only partially in said via to cause said compound curved surface to contact a proximal perimeter of said via;
• and
• a solder located in said via and proximate said conductive mount, said conductive mount of a sufficiently low weight such that a surface tension of a liquid state of said solder is sufficient to maintain said conductive mount in contact with said via as said solder is brought to said reflow temperature, said conductive mount being capable of mounting said substrate to an adjacent substrate and providing a conductive path therebetween.