Printed circuit board substrate having solder mask-free edges
AssigneeIntel Corporation
InventorsJoseph C. Barrett, Mark P. Jamieson
Life of this patent
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Abstract
A substrate for a plurality of electronic assemblies includes a strip of printed circuit board (PCB) material including a surface and a plurality of segments. Each segment is adapted to receive at least one electronic component and is arranged to be singulated into a plurality of individual electronic assemblies. Each segment has a perimeter portion located generally about the periphery of the segment, with the surface being covered with a solder mask, except for the perimeter portion.
Claims8
A substrate for a plurality of electronic assemblies, comprising:
- a strip of printed circuit board (PCB) material;
- a first surface of said strip of PCB material, said first surface covered with a solder mask;
- a plurality of segments of said strip of PCB material, each segment to receive at least one electronic assembly following a singulation of said segment at a perimeter portion of said segment, said perimeter portion devoid of solder mask at said first surface prior to said singulation, without cutting into said PCB material.
A substrate for a plurality of electronic assemblies, said substrate comprising:
- a strip of printed circuit board (PCB) material;
- a surface of said strip of PCB material, said surface having a solder mask;
- a perimeter portion of said PCB material;
- and
- a plurality of segments of said strip of PCB material, each segment adapted to receive at least one electronic component and comprising at least one electronic assembly following a singulation of said segment wherein said singulation includes avoidance of said solder mask without said avoidance cutting into said perimeter portion.
Dependencies are inferred from the claim text.