Ethylene homopolymer and its molded article
AssigneeIdemitsu Petrochemical Co., Ltd.
InventorsMitsugu Kanzawa, Fumio Okuda, Tatsuya Housaki, Tomio Tatsumi
Life of this patent
Estimating the term…
Abstract
Provided are an ethylene homopolymer having well-balanced properties of good heat resistance, good heat-sealability and good moldability, and its molded articles. The ethylene homopolymer is characterized in that the number of butyl branches per 100 methyl branches therein falls between 1 and 20, as measured through 13C-NMR, that its density, d (kg/m3), falls between 880 and 980, and that the density, d, and its melting point, Tm (° C.) , satisfy the conditions defined by the following formulae (1) to (3): Tm≧1.2×d−982 (980≧d≧925) (1), Tm≧0.6×d−430 (925>d≧915) (2), Tm≧0.16×d−28.4 (915>d≧880) (3). The ethylene homopolymer is molded into moldings.
Claims21
An ethylene homopolymer, wherein the homopolymer has a number of butyl branches per 100 methyl branches of 1 to 20 when measured by 13C-NMR, a density d of 880 to 980 kg/m3, a ratio of the weight-average molecular weight to the number average molecular weight (Mw/Mn) of at least 5, and the density d and a melting point Tm as measured by differential scanning calorimetry which satisfy the following Formula 1:
- Tm(°C.)≧1.2×d−982 (1)
- when d is 925 to 980 kg/m3;
- which satisfy the following Formula 2:
- Tm(°C.)≧0.6×d−430 (2)
- when d is equal to or higher than 915 and lower than 925;
- and
- which satisfy the following Formula 3:
- Tm(°C.)≧0.16×d−28.4 (3)
- when d is equal to or higher than 880 and lower than 915.
Dependencies are inferred from the claim text.