Polyimide resin composition
AssigneeNippon Zeon Co., Ltd.
InventorsAkira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
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Abstract
A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
Claims8
A polyimide resin composition comprising at least one polyimide resin (A) comprising a photosensitive polyimide resin or a polyimide resin precursor selected from the group consisting of photosensitive polyamide acids and photosensitive polyamide acid esters, and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, a 5-substituted 1H-tetrazole, a 1-substituted 1H-tetrazole, 5,5′-bis-1H-tetrazole, and a derivative of 5,5′-bis-1H-tetrazole, wherein the photosensitive polyimide resin, photosensitive polyamide acid or photosensitive polyamide acid ester comprises a photosensitive auxiliary, a photopolymerization initiator and a sensitizer.
A polyimide resin composition comprising at least one polyimide resin (A) comprising a polyimide resin precursor selected from the group consisting of photosensitive polyamide acids and photosensitive polyamide acid esters, and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, a 5-substituted 1H-tetrazole, a 1-substituted 1H-tetrazole, 5,5′-bis-1H-tetrazole, and a derivative of 5,5′-bis-1H-tetrazole.
Dependencies are inferred from the claim text.