Back to results
US 6,310,120 B1Granted
Flip-chip type semiconductor device sealing material
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsToshio Shiobara, Kazuaki Sumita
Life of this patent
Estimating the term…
Abstract
A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) spherical silica, (D) a soft x-ray non-transmissive spherical inorganic filler, and (E) a curing accelerator is suited as an underfill material for flip-chip type semiconductor devices. The sealing material has improved thin-film infiltration and storage stability. The filled state or seal defects can be readily inspected using soft x-rays.
Claims5
A flip-chip type semiconductor device sealing material comprising
- (A) 100 parts by weight of a liquid epoxy resin,
- (B) 0 to 100 parts by weight of a curing agent,
- (C) 50 to 300 parts by weight of spherical silica per 100 parts by weight of components (A) and (B) combined,
- (D) an effective amount to prohibit transmission of soft x-rays of a soft x-ray non-transmissive spherical inorganic filler, 50-100 weight-% of which is composed of a spherical zirconium containing compound oxide or zirconium oxide, and
- (E) 0.01 to 10 parts by weight of a curing accelerator per 100 parts by weight of components (A) and B) combined.
2 more elements
Dependencies are inferred from the claim text.