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US 6,310,020 B1Granted
Stripping composition for resist
AssigneeKao Corporation
InventorsMami Shirota, Kozo Kitazawa, Eiji Kashihara, Eiji Nagoshi
Life of this patent
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Abstract
A stripping composition for a resist comprising a polycarboxylic acid and/or a salt thereof, and water, wherein a pH of the stripping composition is less than 8; and a stripping composition for a resist comprising 0.01 to 90% by weight of an organic acid and/or a salt thereof, 2 to 74% by weight of water, and 0.5 to 90% by weight of an organic solvent, wherein a pH of the stripping composition is less than 8; and a method of stripping a resist from a substrate, comprising applying one of the stripping composition to the substrate.
Claims9
A stripping composition for a resist, comprising:
- a stripping agent, which is a polycarboxylic acid or a salt thereof;
- an organic silicon compound;
- and
- water,
- wherein the stripping composition has a pH of less than 8.
2 more elements
Dependencies are inferred from the claim text.