Methods of forming flip chip bumps and related flip chip bump constructions

A method of preparing a flip chip bump comprising:

• dipping at least a portion of a bump comprising conductive material disposed over a substrate into a conductive flowable material, at least some of the conductive flowable material remaining over the bump;
• while flowable material remaining over the bump is in a generally flowable state, engaging the flowable material with a generally planar surface;
• rendering the flowable material remaining over the bump into a generally non-flowable state;
• and
• separating the substrate from the generally planar surface.

A method of preparing a series of flip chip bumps comprising:

• dipping at least portions of conductive bumps formed over a substrate into a conductive flowable material, at least some of the conductive flowable material remaining over the bumps;
• while flowable material remaining over the bumps is in a generally flowable state, engaging the flowable material with a generally planar surface;
• rendering the flowable material into a generally non-flowable state;
• and
• separating the substrate from the generally planar surface.

A method of interconnecting a pair of substrates comprising:

• dipping at least a portion of a bump into a volume of conductive flowable material, at least some of the flowable material remaining over the bump with an entirety of the bump being outwardly exposed;
• solidifying conductive flowable material remaining over the bump, the solidified conductive material having an entirely exposed outermost surface;
• and
• conductively bonding the substrate with a second substrate through the solidified conductive material.

A method of interconnecting a pair of substrates comprising:

• immersing at least a portion of a bump formed over a first substrate in a flowable epoxy;
• removing the bump from the flowable epoxy;
• substantially curing flowable epoxy remaining over the bump and forming a bump assembly;
• and
• bonding the bump assembly with a second substrate.

A method of interconnecting a pair of substrates comprising:

• dipping at least a portion of a height of a conductive bump into a volume of conductive flowable material, the bump being disposed on a first substrate, at least some of the conductive flowable material remaining over the bump;
• solidifying conductive flowable material remaining over the bump and forming a bump assembly comprising the bump and solidified conductive material, the solidified conductive material defining a bump assembly outermost surface the entirety of which is outwardly exposed, the outermost surface defining a bump assembly height greater than the bump height;
• and
• bonding the bump assembly with a second substrate.

A method of preparing a series of flip chip bumps comprising:

• dipping at least portions of a plurality of conductive bumps into a conductive flowable material, individual ones of the plurality of conductive bumps being formed to have one of at least two different heights over a substrate;
• while flowable material remaining over the bumps is in a generally flowable state, engaging the flowable material with a generally planar surface;
• rendering the flowable material into a generally non-flowable state;
• and
• separating the substrate from the generally planar surface to provide a plurality of bump assemblies having a common height.