Precision marking and singulation method

A method comprising:

• identifying a reference feature on a front-side surface of a wafer comprising an array of electronic components;
• forming a first alignment mark on a back-side surface of said wafer;
• and
• using said first alignment mark to determine a position of said reference feature.

A method comprising:

• identifying a reference feature on a front-side surface of a substrate;
• painting a back-side surface of said substrate with a first colored ink;
• forming a first alignment mark on said first colored ink with a contrasting second colored ink;
• and
• using said first alignment mark to determine a position of said reference feature.

A method comprising:

• identifying a scribe grid on a front-side surface of a substrate, said scribe grid comprising a vertical scribe line and a horizontal scribe line;
• forming a first alignment mark on a back-side surface of said substrate, said first alignment mark comprising a vertical segment and a horizontal segment intersecting said vertical segment, said horizontal segment being perpendicular to said vertical segment, said vertical segment being parallel to said vertical scribe line, said horizontal segment being parallel to said horizontal scribe line;
• and
• using said first alignment mark to determine a position of said scribe grid.

A method comprising:

• identifying a reference feature on a front-side surface of a substrate;
• forming a first alignment mark on a back-side surface of said substrate, said first alignment mark comprising a first segment and a second segment parallel to said first segment;
• using said first alignment mark to determine a position of said reference feature;
• and
• cutting said substrate from said back-side surface between said first segment and said second segment and along a scribe line of said reference feature.

A method comprising:

• identifying a first scribe grid on a front-side surface of a substrate;
• marking a back-side surface of said substrate with a second scribe grid precisely corresponding to said first scribe grid;
• and
• using said second scribe grid to determine a position of said first scribe grid.