Technique for attaching die to leads
AssigneeMicron Technology, Inc.
InventorHugh E. Stroupe
Life of this patent
Estimating the term…
Abstract
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extends across the semiconductor die and terminates over its respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
Claims21
A method of connecting a semiconductor die to a lead of a lead frame comprising:
- providing said semiconductor die having at least one bond pad on a surface of said semiconductor die;
- disposing a plurality of leads of said lead frame over said semiconductor die wherein at least one of said plurality of leads extends over the at least one bond pad;
- and
- connecting an elongated strip of anisotropically conductive elastomeric material between said at least one bond pad and said at least one lead of said plurality of leads.
A method of attaching a semiconductor die for the burn-in testing thereof comprising:
- providing at least one circuit trace mounted to a substrate and terminating in at least one pattern of at least one trace end on a surface of said substrate;
- configuring said at least one trace end pattern to correspond to a pattern of at least one bond pad on a semiconductor die to be tested;
- and
- contacting said at least one trace end pattern on said substrate surface with an elongated strip of anisotropically conductive elastomeric material.
Dependencies are inferred from the claim text.