Microelectronic components with frangible lead sections
AssigneeTessera, Inc.
InventorsBelgacem Haba, Kurt Raab
Life of this patent
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Abstract
Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The lead is formed by depositing a layer of lead forming material over an irregularity provided on a supporting substrate so as to provide a region of altered crystal morphology. The region of altered crystal morphology provides the lead with the weakened region.
Claims31
A method of making a lead having a frangible intermediate section for use in a microelectronic component, said method comprising the steps of depositing a metal layer over a support;
- providing an irregularity on said metal layer;
- depositing lead forming material over said metal layer and said irregularity;
- and removing said irregularity whereby said lead includes a frangible intermediate section at the location of said irregularity.
A method of making a microelectronic component comprising the steps of forming at least one lead from lead forming material extending over a gap extending through a vertical extent of a support structure, each said lead having a first connection section extending from the support structure on one side of the gap, a second connection section extending from the support structure on the other side of the gap, and a frangible intermediate section joining said connection sections, said frangible intermediate section formed by depositing said lead forming material over an irregularity at the location of said frangible intermediate section, said frangible intermediate section and at least a part of said first connection section aligned over said gap so that said first connection section of each lead can be detached from said second connection section by breaking the frangible intermediate section upon being displaced in said gap.
Dependencies are inferred from the claim text.