Method and system for removing a die from a semiconductor package
AssigneeAdvanced Micro Devices, Inc.
InventorsMehrdad Mahanpour, Jose Hulog
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Abstract
A method and system for removing a die from a semiconductor package is disclosed. The semiconductor package includes the die and a ceramic base. The die has a first face, a second face and a plurality of sides. The second face of the die is coupled with the ceramic base. The method and system include covering at least the first face and a portion of the plurality of sides of the die with a hard wax and encapsulating the hard wax and at least a first portion of the ceramic base in a resin. The method and system also include removing at least a second portion of the ceramic base to expose the second face of the die and removing the hard wax to free the die.
Claims11
A method for removing a die from a semiconductor package, the semiconductor package including the die and a ceramic base, the die having a first face, a second face and a plurality of sides, the second face of the die coupled with the ceramic base, the method comprising the steps of:
- (a) covering at least the first face and a portion of the plurality of sides of the die with a hard wax;
- (b) encapsulating the hard wax and at least a first portion of the ceramic base in a resin;
- (c) removing at least a second portion of the ceramic base to expose the second face of the die;
- and
- (d) removing the hard wax to free the die.
Dependencies are inferred from the claim text.