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US 6,309,898 B1Granted
Method for manufacturing semiconductor device capable of improving manufacturing yield
AssigneeNEC Corporation
InventorYuji Kayashima
Life of this patent
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Abstract
In a method for manufacturing a semiconductor device, probe pads are formed simultaneously with formation of an intermediate conductive layer, and a test operation is performed upon the semiconductor device by placing probes on the probe pads. Then, post-stage processes are performed upon the semiconductor device in accordance with characteristics of the semiconductor device obtained by the test operation.
Claims7
A method for manufacturing a semiconductor device, comprising the steps of:
- forming probe pads simultaneously with formation of an intermediate conductive layer;
- performing a test operation upon said semiconductor device by placing probes on said probe pads;
- and
- performing post-stage processes upon said semiconductor device in accordance with characteristics of said semiconductor device obtained by said test operation.
1 more element
Dependencies are inferred from the claim text.