Circuit substrate
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsYutaka Hirashima, Yoshitaka Taniguchi, Yasuhito Hushii, Yoshihiko Tujimura, Katsunori Terano, Takeshi Gotoh, Syoji Takakura, Nobuyuki Yoshino, Isao Sugimoto, Akira Miyai
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Abstract
A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu.
Claims24
A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu, wherein the layer comprising Al and Cu has an amount of Cu ranging from 1 to 6 wt %.
A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a bonding material comprising an Al—Cu type alloy or a mixture containing Al and Cu, wherein the bonding material comprises at least 86 wt % of Al, from 1 to 6 wt % of Cu and at most 3 wt % of Mg (not including O).
Dependencies are inferred from the claim text.