Method of manufacturing enhanced finish sputtering targets
AssigneePraxair S.T. Technology, Inc.
InventorsJames Elliot Joyce, Thomas John Hunt, Paul Sandford Gilman
Life of this patent
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Abstract
A method is provided for achieving an enhanced finish on a sputter target surface that results in good film uniformity, low particle counts, and little to no bum-in time. The method involves chemically etching the surface of the sputter target by immersing the surface one or more times in an etching solution, with intermediate rinsing steps. The result is a surface substantially free of mechanical deformation that exhibits a surface similar to a sputtered target with a surface roughness of 10-30 μin.
Claims5
A method of enhancing finish of a sputter target surface to achieve a reduced burn-in time during sputtering comprising:
- finishing the surface of the sputter target to provide a surface roughness of less than about 25 μin.;
- immersing the sputter target in an etching solution one or more times to form an etched target;
- and
- rinsing the etched target in water wherein the etched sputter target has a surface roughness of about 10 to about 30 μin. to decrease the burn-in time for the etched sputter target in comparison to the burn-in time for the surface of the sputter target after the finishing step.
A method of enhancing finish of a sputter surface of a sputter target to achieve a reduced bum-in time during sputtering, comprising the steps of:
- finishing the surface of the sputter target to provide a surface roughness of less than about 25 μin.;
- immersing the sputter surface in a first solution of an etchant and water;
- rinsing the sputter surface with water;
- immersing the sputter surface in a second solution of an etchant and water to form an etched target;
- rinsing the sputter surface with water;
- rinsing the sputter surface with a third solution of alcohol and water;
- and
- drying the sputter surface wherein the sputter surface has a surface roughness of about 10 to about 30 μin. to decrease the burn-in time for the etched sputter target in comparison to the surface of the sputter target after the finishing step.
A method of enhancing finish of a sputter surface of a titanium sputter target comprising the steps of:
- finishing the surface of the sputter target to provide a surface roughness of less than about 25 μin.;
- immersing the sputter surface in a first solution of hydrofluoric acid in water;
- rinsing the sputter surface with water to remove the hydrofluoric acid;
- immersing the sputter surface in a second solution of hydrofluoric acid and nitric acid in water with at least intermittent agitation to form an etched target;
- rinsing the sputter surface with water to remove the hydrofluoric acid and the nitric acid;
- rinsing the sputter surface with a third solution of alcohol in water;
- and
- drying the sputter surface with a force flow of dry gas wherein the sputter surface has a surface roughness of about 10 to about 30 μin. to decrease the burn-in time for the etched sputter target in comparison to the surface of the sputter target after the finishing step.
Dependencies are inferred from the claim text.