Substrate processing apparatus and method
AssigneeCanon Kabushiki Kaisha
InventorsToru Takisawa, Takao Yonehara, Kenji Yamagata
Life of this patent
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Abstract
One wafer is placed on a wafer support table with its frontside facing upward, and the other wafer is chucked by a wafer chuck portion with its frontside facing upward. The wafer chuck portion is pivoted about a shaft through about 180° to make the two wafers face each other substantially parallel. In response to the cancel of the chucking of the upper wafer by the wafer chuck portion, the central portion of the upper wafer is pressed by a press pin to superimpose the two wafers.
Claims19
A substrate processing apparatus for overlapping and contacting two substrates, characterized by comprising:
- substrate operation means for supporting said two substrates to face each other, and then canceling the support of one substrate;
- and
- press means for pressing part of a backside of one substrate at substantially the same time as the cancel of the support of one substrate by said substrate operation means to superimpose one substrate on the other substrate.
A substrate processing method of overlapping and contacting two substrates, characterized by comprising:
- supporting said two substrates to face each other, then canceling the support of one substrate, pressing part of a backside of one substrate at substantially the same time as the cancel, and superimposing one substrate on the other substrate.
A substrate processing method of overlapping and contacting two substrates, characterized by comprising:
- substantially horizontally supporting said two substrates to face each other, then canceling the support of an upper substrate of said two substrates, pressing part of said upper substrate at substantially the same time as the cancel of the support, and superimposing said upper substrate on said lower substrate.
A contacting method of contacting two wafers by using a wafer processing apparatus having first and second wafer support tables and wafer alignment unit, the second wafer support table having a chucking mechanism, the method comprising steps of:
- placing a first wafer which has been aligned by the wafer alignment unit on the first wafer support table;
- placing a second wafer which has been aligned by the wafer alignment unit on the second wafer support table;
- facing the fist and second wafers while chucking the second wafer by the chucking the second wafer by the chucking mechanism so that the second wafer is arranged above the first wafer;
- and
- contacting the first and second wafers.
Dependencies are inferred from the claim text.