Method of grinding semiconductor articles
AssigneeDisco Corporation
InventorsYukihiro Kaneda, Shuichi Takizawa
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Abstract
Disclosed is a method of grinding semiconductor articles comprising the steps of: dicing a semiconductor wafer having bumps formed on one surface into individual chips or pellets; putting the pellets on a printed-wiring board with their flat, bump-less surfaces up; bonding the bumps of the pellets to the electrodes of the printed-wiring board; and grinding the flat, bump-less surfaces of the pellets simultaneously so that they may have a predetermined reduced thickness. The grinding post bonding has the advantageous effect of preventing pellets from being broken or fractured.
Claims2
A method of grinding semiconductor articles comprising the steps of:
- (a) dicing a semiconductor wafer having bumps formed on one surface to separate individual pellets;
- (b) after step (a), putting the individual pellets on a printed-wiring board with their flat, bump-less surfaces up so that each bump abuts on a selected area of the printed-wiring board to form a space between the individual pellets and the printed-wiring board;
- (c) after step (b), bonding each pellet to the selected area of the printed-wiring board via its bumps;
- (d) after step (c), filling the space with a resin and curing the resin whereby the pellets are firmly fixed to the printed-wiring board to provide a pellet-and-wiring board combination as a single solid body;
- and
- (e) after step (d), holding fixedly the pellet-and-wiring board combination on a chuck table of a grinder to grind the flat, bump-less surfaces of the pellets to a predetermined reduced thickness.
Dependencies are inferred from the claim text.