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US 6,308,738 B1Granted
Drafting apparatus
AssigneeUnited Microelectronics Corp.
InventorsTien-Jui Liu, Eric Chu, Tony Chen
Life of this patent
Estimating the term…
Abstract
A drafting apparatus in a furnace. A buffer board having a plurality of gas intakes is disposed in a front end of the drafting apparatus. A laminar flow board having a plurality of gas outtakes is disposed in a rear end of the drafting apparatus. A drafting region is enclosed by the drafting apparatus. The drafting region comprises at least one drafting board to draft and redirect the gas flow. A laminar flow is then obtained to flow through the outtakes on the laminar board.
Claims3
A drafting apparatus, comprising:
- a buffer board, having a plurality of gas intakes disposed in a front end of the drafting apparatus;
- a laminar flow board, having a plurality of gas outtakes disposed in a rear end of the drafting apparatus;
- a drafting region, enclosed by the drafting apparatus;
- and
- a drafting board disposed within the drafting region and having at least two members, the at least two members being both laterally and longitudinally offset from each other so that a principal gas flow is channeled through the drafting region in a substantially serpentine fashion.
2 more elements
A drafting apparatus, comprising:
- a buffer board, having a plurality of gas intakes dispose in a front end of the drafting apparatus, wherein the buffer board is in a curved shape
- a laminar flow board, having a plurality of gas outtakes dispose in a rear end of the drafting apparatus;
- a drafting region, enclosed by the drafting apparatus;
- and
- at least one drafting board, located in the drafting region.
2 more elements
Dependencies are inferred from the claim text.