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US 6,308,579 B1Granted
Apparatus and methods for forming a bond strength adherend
AssigneeUltradent Products, Inc.
InventorsNeil T. Jessop, Jeff A. Wagner
Life of this patent
Estimating the term…
Abstract
Apparatus and methods for forming an adherend and bonding the adherend to a test piece. A bonding and molding platform is used to form a cylindrically shaped adherend that is bonded to the test piece. The bonding and molding platform limits the bond site to a particular area on the test piece. The bonding and molding platform forms an adherend that is substantially cylindrically shaped and substantially perpendicular to the substrate.
Claims46
A bonding and molding platform for bonding an adherend to a bond site of a test piece, the platform comprising:
- a body having a top surface opposite a bottom surface and a perimeter edge configured to be removably held in a clamp assembly;
- molding means for forming an adherend on a bond site of the test piece from a hardenable material delivered into the molding means, the molding means extending downwardly through the body;
- and
- a perimeter support member extending perpendicularly from the bottom surface of the body, wherein the perimeter support member is positioned such that the perimeter support member rests on the test piece during use.
1 more element
A bonding and molding platform for bonding an adherend to a bond site of a test piece comprising:
- a body having a top surface opposite a bottom surface and a perimeter edge configured to be removably held in a clamp assembly;
- a mold extending downwardly through the body and having a top end and an outlet end, wherein the mold defines a conduit extending from the top end to the outlet end, wherein the conduit is accessible from a portal in the top surface of the body, wherein the mold provides for delivery of a hardenable material into the conduit of the mold and then onto a bond site of the test piece;
- and
- a perimeter support member extending downward from the body and configured to be braced against the test piece.
1 more element
A bonding and molding platform for bonding an adherend in a test piece comprising:
- a body having a top surface opposite a bottom surface, the body having a perimeter with a portion configured to be removably held in a clamp assembly, the top surface having a centrally located countersunk portion;
- a mold extending downwardly through the body and having a top end opposite an outlet end, wherein the mold has a portal at the top end located in the countersunk portion of the body, wherein the mold defines a conduit extending from the portal to an outlet rim in the outlet end, wherein the conduit has uniform diameter along its length, wherein the mold tapers in width at the outlet end toward the outlet rim, wherein the mold provides for delivery of a hardenable material into the conduit of the mold and then onto a bond site of the test piece;
- and
- a perimeter support member extending perpendicularly from the bottom surface of the body, wherein the perimeter support member is inset from the perimeter of the body and is configured to rest on the test piece, wherein the perimeter support member and the mold extend from the body with approximately equal lengths.
1 more element
An apparatus for bonding an adherend to a bond site of a test piece, the apparatus comprising:
- bonding means for receiving a hardenable material and for enabling light to be directed to the hardenable material to yield an adherend on a bond site of the test piece the bonding means being configured such that the bonding means does not alter the structure or position of the adherend when removed from the adherend;
- means for holding the bonding means and the test piece in a fixed position with respect to each other such that the bonding means is above the test piece while the adherend is formed and bonded to the test piece,
An apparatus for bonding an adherend to a bond site of a test piece, the apparatus comprising:
- a bonding and molding platform including:
- a body having a top surface opposite a bottom surface and a perimeter;
- molding means for forming an adherend on a bond site of the test piece from a hardenable material delivered into the molding means, the molding means extending downwardly through the body;
- and
- supporting means for bracing the platform on the test piece, the supporting means extending downward from the bottom surface of the body, the supporting means and molding means extending from the body with approximately equal lengths;
- and
- means for holding the platform and the test piece in a fixed position with respect to each other.
4 more elements
An apparatus for bonding an adherend to a bond site of a test piece, the apparatus comprising:
- a bonding and molding platform including:
- a body having a top surface opposite a bottom surface and a perimeter;
- molding means for forming an adherend on a bond site of the test piece from a hardenable material delivered into the molding means, the molding means extending downwardly through the body;
- and
- supporting means for bracing the platform on the test piece, the supporting means extending downward from the bottom surface of the body;
- and
- a clamp assembly including
- a base;
- a plate having two apertures, wherein the plate has a slot configured to removably receive the perimeter of the body of the platform such that the platform is securely and removably held;
- two posts mounted to the base such that each post extends vertically from the base, wherein each post is configured to pass slidably through one aperture in the plate;
- and
- two retention nuts, each retention nut configured to removably mate with each post, wherein the retention nuts provide for the test piece to be securely and removably held with respect to the platform.
9 more elements
An apparatus for bonding an adherend to a bond site of a test piece, the apparatus comprising:
- a bonding and molding platform including:
- a body having a top surface opposite a bottom surface and a perimeter;
- a mold extending downwardly through the body and having a top end opposite an outlet end, wherein the mold has a portal at the top end located in a countersunk portion of the body, wherein the mold defines a conduit extending from the portal to an outlet rim in the outlet end, wherein the conduit has uniform diameter along its length, wherein the mold tapers in width at the outlet end toward the outlet rim, wherein the mold provides for delivery of a hardenable material into the conduit of the mold and then onto a bond site of the test piece;
- and
- a perimeter support member extending perpendicularly from the bottom surface of the body, wherein the perimeter support member is inset from the perimeter of the body and is configured to rest on the test piece, wherein the perimeter support member and the mold extend from the body with approximately equal lengths;
- a clamp assembly including
- a base;
- a plate having two apertures, wherein the plate has a slot configured to removably receive the perimeter of the body of the platform such that the platform is securely and removably held;
- two posts mounted to the base such that each post extends vertically from the base, wherein each post is configured to pass slidably through one aperture in the plate;
- two retention nuts, each retention nut configured to removably mate with one of the two posts;
- and
- two disc springs, each of the disc springs being positioned on one of the two posts such that one of the two retention nuts is tightenable against one of the two disc springs, wherein the retention nuts provide for the test piece to be securely and removably held with respect to the platform.
9 more elements
A method for forming a bond between an adherend and a test piece, said method comprising the steps of:
- providing a test piece having a surface;
- obtaining a bonding means for receiving a hardenable material and for enabling light to be directed to the hardenable material;
- placing the bonding means in a fixed position with respect to the test piece such that the bonding means is above the test piece;
- depositing a hardenable material into the bonding means in a manner so as to contact only a bonding portion of the surface of the test piece defining a bond site;
- and
- directing curing light to the hardenable material to harden the hardenable material, thereby forming an adherend on the bond site of the test piece.
3 more elements
Dependencies are inferred from the claim text.