Magneto-optical head with integral mounting of lens holder and coil
AssigneeSeagate Technology LLC
InventorsJohn H. Jerman, Joseph E. Davis
Life of this patent
Estimating the term…
Abstract
An integrated coil support and lens holder assembly for a magneto-optical read/write head defined on at least one wafer with a coil supported on a first surface including leads extending to an electrical feedthrough supported in part on the first surface, a lens supporting region supporting a lens in alignment with an open center region of the coil, an electrical feedthrough region defined adjacent the lens and extending through the integrated coil support and lens holder assembly to a second surface, an electrical contact layer extending through to the first surface to contact the electrical cross-over region for the coil, and ABS features incorporated in the integrated coil support and lens holder assembly.
Claims8
A lens holder and a coil assembly for reading and writing magneto-optical data forming an integrated assembly in semiconductor wafers comprising
- a first wafer having a front and a back;
- a second wafer;
- a coil formed in a depression on a surface on said front of said first wafer, said depression being of a sufficient depth to maintain said surface substantially planar when said surface is bonded to said second wafer;
- said coil having leads forming a part of said first wafer to spaced bonding pads on said first wafer;
- said second wafer being bonded to said surface of said first wafer;
- a first region in said second wafer supporting a lens aligned with an opening in substantially a center of said coil for passing a light through said opening;
- and
- a second region in said second wafer bonded to said first wafer comprising a feedthrough passing through said second wafer for allowing electrical connections to said bonding pads.
A method for having a lens holder and a coil forming an integrated assembly in semiconductor wafers comprising
- a first wafer having a front and back;
- a second wafer;
- forming a coil on a surface on said front of said first wafer in a depression, said depression of a sufficient depth to maintain said surface substantially planar for bonding said surface to said second wafer;
- forming leads as a part of said first wafer from said coil to spaced bonding pads in said first wafer;
- bonding said second wafer to said surface of said first wafer;
- supporting a lens in a first region in said second wafer aligned with an opening in substantially a center of said coil for passing a light through said opening;
- and
- forming a feedthrough in a second region in said second wafer passing through said second wafer comprising a method for electrical connection to said bonding pads.
Dependencies are inferred from the claim text.