Test carrier with variable force applying mechanism for testing semiconductor components
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Salman Akram, James M. Wark, Derek Gochnour
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Salman Akram, James M. Wark, Derek Gochnour
Estimating the term…
A semiconductor carrier for testing semiconductor components, such as bare dice and chip scale packages, and a method for testing components using the carrier, are provided. The carrier includes a base, an interconnect for making temporary electrical connections with the component, and a force applying mechanism for biasing the component against the interconnect. The force applying mechanism includes an elastomeric biasing member adapted to apply a relatively large biasing force during assembly of the carrier and a smaller biasing force in the assembled carrier. The force applying mechanism also includes a pressure plate which can include a cushioning layer with a non-stick surface for contacting the component. In addition, the cushioning layer, and elastomeric biasing member can be made of conductive elastomers to provide an electrical path from a backside of the component.
A test carrier for a semiconductor component comprising:
A test carrier for a semiconductor component comprising:
A test carrier for a semiconductor component comprising:
A test carrier for a semiconductor component comprising:
A test system for a semiconductor component comprising:
A test system for a semiconductor component comprising:
Dependencies are inferred from the claim text.