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US 6,307,392 B1Granted
Probe card and method of forming a probe card
AssigneeNEC Corporation
InventorsKoji Soejima, Naoji Senba
Life of this patent
Estimating the term…
Abstract
One main surface of a substrate has formed on it an appropriate contact terminal having in one part thereof a protruding part. An end of a lead is mounted via a holding part that is provided between the substrate and a probe, the lead being disposed along the main surface of the substrate so as to peel away from the main surface.
Claims32
A probe card comprising:
- a substrate;
- a lead provided on a part of a first main surface of the substrate, one end part of the lead being joined to said substrate via a first holding part;
- and
- a contact terminal provided on a part of the lead.
1 more element
A method for manufacturing a probe card comprising the steps of:
- providing a lead-supporting substrate having a die part for forming a contact terminal;
- forming a lead having a contact terminal on the lead-supporting substrate by disposing a thin film of a prescribed shape on the lead-supporting substrate;
- providing a probe card substrate having a prescribed wiring part;
- forming a holding section on an edge part of said thin film separated from said contact terminal;
- joining together said holding section and said probe card substrate;
- and
- moving said probe card substrate away from said lead-supporting substrate, so that the thin film forming the lead is pulled away from contact with said lead-supporting substrate and remains connected to the probe card substrate through the holding section.
4 more elements
A method for manufacturing a probe card comprising the steps of:
- providing a lead-supporting substrate having a die part for forming a contact terminal;
- forming a lead having a contact terminal on the lead-supporting substrate by disposing a thin film of a prescribed shape on the lead-supporting substrate;
- providing a probe card substrate having a prescribed wiring part;
- forming a holding section on said probe card substrate;
- joining together said holding section and one end part of said lead separated from said contact terminal;
- and
- moving said probe card substrate away from said lead-supporting substrate, so that the thin film forming the lead is pulled away from contact with said lead-supporting substrate and remains connected to the probe card substrate through the holding section.
4 more elements
Dependencies are inferred from the claim text.