Aligner and method for inspecting semiconductor wafer using shell
AssigneeTokyo Electron Limited
InventorsYutaka Akaike, Isao Kono, Satoshi Sano
Life of this patent
Estimating the term…
Abstract
An aligner according to the present invention is constituted by integrating a wafer chuck, a wafer and a contactor, which are aligned with one another, into one piece by vacuum adsorptivity. A vacuum exhaust apparatus for generating the vacuum adsorptivity, includes first and second valve mechanisms, a valve operation mechanism for opening/closing these valve mechanisms, first and second solenoid valves connected to the valve operation mechanism through a vacuum exhaust line, and a vacuum leak detecting pressure gauge interposed between the first solenoid valve and the valve operation mechanism.
Claims9
A method of creating a transportable shell holding a semiconductor wafer to be tested therein, the method comprising:
- placing a wafer holding member on a table and holding the wafer holding member thereon by vacuum adsorptivity;
- placing the semiconductor wafer on the wafer holding member and holding the semiconductor wafer thereon by vacuum adsorptivity;
- bringing a contactor into contact with the semiconductor wafer which is held on the wafer holding member by the vacuum adsorptivity, and holding the contactor on the wafer holding member by reducing a pressure between the contactor and the wafer holding member to create the shell which comprises the wafer holding member, the semiconductor wafer and the contactor each being connected to each other to make one integrated unit;
- confirming the vacuum adsorptivity by which the contactor and the semiconductor wafer are held on the wafer holding member, using a pressure detector;
- and
- releasing the vacuum adsorptivity by which the wafer holding member is held on the table, and allowing the shell to move from the table.
An aligner for creating a transportable shell, comprising:
- a contactor having a plurality of contact terminals for bringing the contactor into contact with a semiconductor wafer;
- a wafer holding member including a first vacuum holding mechanism for holding the semiconductor wafer by vacuum adsorptivity and a second vacuum holding mechanism for holding the contactor by vacuum adsorptivity, the contactor being configured to be brought into contact with the semiconductor wafer which is held on the wafer holding member by the vacuum adsorptivity, and to be held on the wafer holding member by reducing a pressure between the contactor and the wafer holding member to create a shell which comprises the wafer holding member, the semiconductor wafer and the contactor each being connected to each other to make one integrated unit;
- a table having a third vacuum holding mechanism for holding the wafer holding member by vacuum adsorptivity;
- and
- at least one pressure gauge connected to the first vacuum holding mechanism, the second vacuum holding mechanism, and the third vacuum holding mechanism,
- wherein the pressure gauge detects a pressure of at least one vacuum holding mechanism in the first vacuum holding mechanism, the second vacuum holding mechanism, and the third vacuum holding mechanism, thereby confirming a vacuum adsorbing state in the vacuum holding mechanism.
An aligner for creating a transportable shell, comprising:
- a contactor having a plurality of contact terminals for bringing the contactor into contact with a semiconductor wafer;
- a wafer holding member including a first vacuum holding mechanism for holding the semiconductor wafer by vacuum adsorptivity and a second vacuum holding mechanism for holding the contactor by vacuum adsorptibity, the first vacuum holding mechanism having at least one sealing member provided on a peripheral portion of a top surface of the wafer holding member, the contactor being configured to be brought into contact with the semiconductor wafer which is held on the wafer holding member by the vacuum adsorptivity, and to be held on the wafer holding member by reducing a pressure between the contactor and the wafer holding member to create a shell which comprises the wafer holding member, the semiconductor wafer and the contactor each is connected to each other to make one integrated unit;
- a table having a third vacuum holding mechanism for holding the wafer holding member by vacuum adsorptivity;
- and
- at least one pressure gauge connected to the first vacuum holding mechanism, the second vacuum holding mechanism, and the third vacuum holding mechanism,
- wherein the pressure gauge detects a pressure of at least one vacuum holding mechanism in the first vacuum holding mechanism, the second vacuum holding mechanism, and the third vacuum holding mechanism, thereby confirming a vacuum adsorbing state in the vacuum holding mechanism.
Dependencies are inferred from the claim text.