Test device for flat electronic assemblies

A test device for testing an electronic board assembly having an exposed surface area with electrical connection locations to be contacted for testing, the device comprising

• a plurality of probes (32, 45) for contacting locations on said surface area for testing;
• a plurality of probe drives (11) each for positioning one said probe to said locations to be contacted within a two-dimensional subarea within said exposed surface area, each said sub-area being smaller than said surface area, each said probe being independently movable by its probe drive;
• and
• means for mounting each said probe drive in a substantially fixed location over said one sub-area of said surface area.

A test device for testing an electronic board assembly having an exposed surface area with electrical connection locations to be contacted for testing, the device comprising

• at least one probe drive (11);
• and
• at least one probe (32, 45) comprising an elongated needle (13) having a probe end, said needle being mounted on one said probe drive for pivotal movement and being driven to selected angular positions relative to said surface area by said at least one probe drive for contact within a two-dimensional sub-area within said surface area, said sub-area being smaller than said surface area;
• each said probe drive comprises X and Y transverse drives (15, 17) at different distances from said surface area, each of said transverse drives comprising a gimbal mount for holding said needle, said needle being longitudinally movable in both said gimbal mounts and being actuated by a vertical drive (26, 30) at an end of said needle remote from said probe end.