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US 6,307,262 B1Granted
Condensed memory matrix
AssigneeMicron Technology, Inc.
InventorsRich Fogal, Alan G. Wood
Life of this patent
Estimating the term…
Abstract
A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.
Claims9
A condensed memory matrix, wherein the improvement comprises:
- a substrate;
- an array of circuit connection structures, carried on a surface of said substrate;
- a layer of dielectric material, filling interstices between said circuit connection structures;
- a wafer, with a plurality of dies, mounted against said dielectric material layer, a surface of said wafer carrying die connection structures juxtaposed against and in conductive relationship with corresponding said circuit connection structures carried by said substrate such that said dielectric material layer also fills interstices between said die connection structures;
- a thermally conductive layer on a portion of said surface of said wafer opposite said surface carrying said die connection structures;
- and
- a heat dissipation device connected to a portion of said thermally conductive layer.
4 more elements
Dependencies are inferred from the claim text.