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US 6,307,261 B1Granted
Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device
AssigneesThomson-CSF, ELA Medical S.A.
InventorsChristian Val, Yves Van Campenhout, Dominique Gilet
Life of this patent
Estimating the term…
Abstract
The semiconductor device comprises at least one chip arranged on a support. The chip is coated with an electrically insulating and heat-stable material. This electrically insulating and heat-stable material is penetrated by electrical-connection leads connecting sites of the chip to metallized contacts, and leads are substantially perpendicular both to the said sites and to the said metallized contacts.
Claims15
A semiconductor device comprising:
- at least one chip having at least one connecting site;
- a first electrically insulating material directly coating a surface of the at least one chip;
- at least one electrical connection lead penetrating the first electrically insulating material to contact the at least one connecting site of the at least one chip and to connect the at least one connecting site of the at least one chip to a metallized contact formed on an outside surface of said first electrically insulating material, wherein the at least one electrical connection lead is substantially perpendicular to both the at least one connection site of the at least one chip and the metallized contact;
- and
- wherein the metallized contact includes a sloping side for facilitating visual inspection.
2 more elements
A semiconductor device having at least one chip including at least one connecting site, comprising:
- a first electrically insulating means directly coating a surface of the at least one chip;
- at least one electrical connection means penetrating the first electrically insulating means to contact the at least one connecting site of the at least one chip and to connect the at least one connecting site of the at least one chip to a metallized contact means formed on an outside surface of said first electrically insulating means, wherein the at least one electrical connection lead is substantially perpendicular to both the at least one connection site of the at least one chip and the metallized contact means.
Dependencies are inferred from the claim text.