US 6,307,257 B1Granted

Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads

AssigneeSiliconware Precision Industries Co., Ltd.

InventorsChien-Ping Huang, Lian-Cherng Chiang, Wen-Ta Tsai

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Abstract

A dual-chip integrated circuit (IC) package is provided, which is characterized in the use of a an extending portion formed from the leads of a leadframe to provide firm support to the bonding pads on the chips. The dual-chip integrated circuit package utilizes a leadframe having a first leads and a second leads, with a spacing being defined between the first and second leads; and the first leads is extended toward the spacing to form the extending portion at a downset position with respect to the second plane where the leadframe positions leads. A first integrated circuit chip is mounted on the extending portion in such a manner that the front side thereof is attached to the extending portion; and a second integrated circuit chip is attached to the first integrated circuit chip in a back-to-back manner. The bonding pads on the two integrated circuit chips are electrically connected to the first and second leads via a plurality of bonding wires. The use of the extending portion for the attachment of the two integrated circuit chips can help prevent delamination of the chips and can provide firm support to the bonding pads on the chips so that the chips can be prevented from being cracked during the wire-bonding process. The manufactured integrated circuit package can therefore be more assured in reliability and quality.

Claims15

Dependent claims

A dual-chip integrated circuit package, which comprises:

a leadframe having a plurality of first leads and a plurality of second leads, with a spacing being defined between the first and second leads;
the first leads each having an extending portion wherein said extending portion extends to a length greater than a length of said second leads;
a first integrated circuit chip having a front side and a back side, with the front side being formed with a plurality of bonding pads;
the first integrated circuit chip being mounted on the extending portion in such a manner that the front side thereof is attached to the extending portion;
a second integrated circuit chip having a front side and a back side, with the front side being formed with a plurality of bonding pads;
the second integrated circuit chip being attached to the first integrated circuit chip in a back-to-back manner;
a plurality of first electric connection means for electrically connecting the bonding pads on the first integrated circuit chip to the second leads of the leadframe;
a plurality of second electric connection means for electrically connecting the bonding pads on the second integrated circuit chip to the first leads of the leadframe;
and
an encapsulant for encapsulating the first integrated circuit chip, the second integrated circuit chip, the first and second electric connection means, and an inner part of the first and second leads of the leadframe.

7 more elements

Dependencies are inferred from the claim text.