Technique for attaching die to leads
AssigneeMicron Technology, Inc.
InventorHugh E. Stroupe
Life of this patent
Estimating the term…
Abstract
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
Claims17
A semiconductor die assembly comprising:
- a semiconductor die having a surface;
- at least one bond pad arranged on said surface of said semiconductor die;
- at least one lead disposed over said semiconductor die extending over the at least one bond pad thereof;
- and
- an elongated strip of anisotropically conductive elastomeric material comprising a laminate of alternating, substantially parallel sheets of a conductive foil and segments of an insulating elastomer, said elongated strip disposed between said at least one lead and said at least one bond pad of said semiconductor die, at least one of said sheets of conductive foil forming a conductive path between said at least one bond pad and said at least one lead.
A burn-in die assembly for testing of a semiconductor die comprising:
- a plurality of circuit traces mounted to a substrate, the ends of the plurality of circuit traces terminating in a pattern on a surface of said substrate;
- said pattern of the ends of the plurality of circuit traces corresponding to a pattern of bond pads of a semiconducter die;
- and
- an elongated strip of anisotropically conductive elastomeric material comprising a laminate of alternating, substantially parallel sheets of a conductive foil and segments of an insulating elastomer, said elongated strip disposed over said pattern between the ends of plurality of circuit traces on said substrate surface, at least one circuit trace of said plurality of circuit traces being connected to a corresponding bond pad of said pattern of bond pads by a conductive path formed by at least one of said sheets of conductive foil.
Dependencies are inferred from the claim text.