Monolithic low dielectric constant platform for passive components and method
OwnerRobert Bruce Daviesinventor
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OwnerRobert Bruce Daviesinventor
Estimating the term…
A method for forming a low dielectric constant insulator in a monolithic substrate and the dielectric formed by a method. The method includes formation and patterning of a mask on a silicon substrate followed by anisotropic etching of the silicon to provide a dense array of deep holes. Isotropic etching may be used to form a cavity beneath the dense array of holes and coupling to bottoms of the holes. Sides of the holes are then thermally oxidized. A conventional dielectric is then formed, sealing tops of the holes. The conventional dielectric is optionally densified. Conventional chemical-mechanical polishing then planarizes the dielectric and further conventional processing may be carried out on the wafer to form active circuitry together with passive components such as high Q inductors.
A silicon substrate including a dielectric platform comprising:
A silicon substrate including a dielectric platform comprising:
An integrated circuit including a dielectric platform comprising a dielectric lattice including an array of holes having a depth that is greater than a width of the holes, sidewalls of the holes being formed from silicon based dielectric and having a thickness of less than one micron, widths of the holes being less than two microns, depth of the holes being greater than two microns, tops of the holes being sealed with silicon based dielectric and bottoms of the holes being coupled to a cavity formed beneath the dielectric lattice.
A dielectric platform formed in a silicon substrate by a method comprising:
Dependencies are inferred from the claim text.