Device for imaging object to be inspected and device for inspecting semiconductor package

A semiconductor package inspection device, which inspects a coplanarity of leads of a semiconductor package housed in a predetermined container, characterized in that the semiconductor package inspection devices comprises:

• lighting means for illuminating with a P polarizing wave a lead portion of the semiconductor package;
• imaging means for imaging the lead portion of the semiconductor package from diagonally above at a predetermined angle, an imaging direction thereof being set at a Brewster angle relative to a side wall of the container;
• and
• inspecting means for inspecting the coplanarity of semiconductor package leads based on image data of the imaging means.

A semiconductor package inspection device, which images an upper surface and a side lead portion of a semiconductor package, and inspects the semiconductor package on the basis of image data thereof, characterized in that the semiconductor package inspection device comprises:

• one visual camera means, which is provided above the semiconductor package, an imaging axis thereof being set at a proximate right angle relative to the upper surface of the semiconductor package, and which is set so that the upper surface of the semiconductor package is located in a center region of a field of view area thereof;
• and
• a light transmitting optical member, which has a predetermined refractive index, and which is provided between the semiconductor package and the visual camera means, a lead portion of the semiconductor package being imaged from diagonally above at a predetermined angle by the visual camera means, and an image thereof being guided to an edge portion region of the field of view area of the visual camera means, and that
• a thickness of the light transmitting optical member is set at a value, which absorbs an optical path length difference between an optical path from the upper surface of the semiconductor package to the visual camera means and an optical path from the side lead portion via the light transmitting optical member to the visual camera means.

A semiconductor package inspection device, which inspects a coplanarity of leads of a semiconductor package housed in a predetermined container, characterized in that the semiconductor package inspection device comprises:

• lighting means for illuminating with a P polarizing wave a lead portion of the semiconductor package;
• one visual camera means, which is provided above the semiconductor package, an imaging axis thereof being set to a proximate right angle relative to an upper surface of the semiconductor package;
• light guiding means, which is provided between the semiconductor package and the visual camera means, for guiding an image of the lead portion of the semiconductor package within a field of view of the visual camera means so that the lead portion of the semiconductor package is imaged from at least two different directions by the visual camera means, and further, one of imaging directions of the two imaging directions, is set to a Brewster angle relative to a side wall of the container;
• and
• inspecting means for inspecting the coplanarity of semiconductor package leads using a triangulation method based on image data of the imaging means.

A semiconductor package inspection device, which images an upper surface and a side lead portion of a semiconductor package, and inspects the semiconductor package on the basis of image data thereof, characterized in that the semiconductor package inspection device comprises:

• one visual camera means, which is provided above the semiconductor package, an imaging axis thereof being set at a proximate right angle relative to the upper surface of the semiconductor package, and which is set to that the upper surface of the semiconductor package is located in a center region of a field of view area thereof;
• a light transmitting optical member, which has a predetermined refractive index, and which is provided between the semiconductor package and the visual camera means, a lead portion of the semiconductor package being imaged from at least two different directions by the visual camera means, and an image thereof being guided to an edge portion region of a field of view area of the visual camera means, and further, the light transmitting optical member either being provided, or a portion thereof being omitted, so as not to intervene in an optical path between the semiconductor package upper surface, and a center region of the field of view area of the visual camera means, where an upper surface image of the semiconductor package is imaged;
• and
• inspecting means for inspecting a coplanarity of semiconductor package leads using a triangulation method based on image data of the imaging means, and that
• a thickness of the light transmitting optical member is set at a value, which absorbs an optical path length difference between an optical path from the upper surface of the semiconductor package to the visual camera means and an optical path from the side lead portion via the light transmitting optical member to the visual camera means.